The development of FFC cable
(1) FFC cable is smaller and lighter in weight. In order to adapt to the thin, light and small characteristics of future electronic products, FFC will require thinner films and conductors below 30um to greatly reduce product quality.
(2) The pin pitch is denser and the height is smaller. In order to improve the flexibility of cables and ensure the quality of signal transmission in miniature products, companies are studying more densely integrated FFCs. In order to reduce signal reflection and improve transmission efficiency, impedance must be controlled to achieve impedance matching.
(3) Improvement of FFC materials. Generally, the working temperature of FFC is below 80℃. In the future, FFC insulating film may be made of liquid crystal polymer and other materials with higher temperature resistance, so that it can be used in harsher environments. In special areas, the exposed gold finger of the FFC cable is gold-plated, which is more resistant to oxidation.